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Part Number

Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , DIGITAL

Definition:

A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".

CAGE Information

Code Company
94756 BOEING COMPANY, THE DIV DEFENSE, SPA

Federal Supply Class

Title

MICROCIRCUITS, ELECTRONIC

Inclusions:

INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.

Exclusions:

EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.

Characteristics (Decoded)

MRC Requirements Statement Clear Text Reply
CZEQ TIME RATING PER CHACTERISTIC 700.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 700.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
CTFT CASE OUTLINE SOURCE AND DESIGNATOR -0-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL
AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 18.5 VOLTS MAXIMUM POWER SOURCE
ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM
ADAU BODY HEIGHT 0.120 INCHES MINIMUM AND 0.195 INCHES MAXIMUM
ADAQ BODY LENGTH 0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS
CQZP INPUT CIRCUIT PATTERN 4 INPUT
CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
CSSL DESIGN FUNCTION AND QUANTITY 1 DECODER, BINARY CODED DECIMAL TO DECIMAL
CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EXPANDABLE AND W/DECODED OUTPUT AND LOW POWER
CWSG TERMINAL SURFACE TREATMENT SOLDER

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