NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
717383-204 | 05869 | A | 3 | 2 | 1 | TX | ||
320H204 | 93332 | H | C | 1 | 6 | ZZ | AC | |
CF620 | 18324 | A | 5 | 2 | 5 | TX | ||
SCM707F | 04713 | A | 5 | 9 | 5 | TX | ||
ROM/PROM FAMILY 004 | 16236 | A | 5 | 1 | 5 | TX | ||
HR0M8256G0582 | 34371 | A | 5 | 9 | 5 | TX |
CAGE Information
Code | Company |
---|---|
04713 | FREESCALE SEMICONDUCTOR INC. |
05869 | RAYTHEON COMPANY DBA RAYTHEON |
93332 | SYLVANIA ELECTRIC PRODUCTS INC SEMIC |
18324 | PHILIPS SEMICONDUCTORS INC |
16236 | DLA LAND AND MARITIME |
34371 | INTERSIL CORPORATION |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
TEST | TEST DATA DOCUMENT | 05869-717383 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
TEST | TEST DATA DOCUMENT | 05869-717383 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
AEHX | MAXIMUM POWER DISSIPATION RATING | 625.0 MILLIWATTS |
CSWJ | WORD QUANTITY (NON-CORE) | 32 |
AGAV | END ITEM IDENTIFICATION | 58404091248 |
CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.075 INCHES MAXIMUM |
CRHL | BIT QUANTITY (NON-CORE) | 256 |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
AFGA | OPERATING TEMP RANGE | +0.0/+75.0 DEG CELSIUS |
ADAQ | BODY LENGTH | 0.340 INCHES MINIMUM AND 0.440 INCHES MAXIMUM |
CBBL | FEATURES PROVIDED | PROGRAMMED AND PROGRAMMABLE AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND EXPANDABLE AND BIPOLAR AND HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/ENABLE AND WIRE-OR OUTPUTS |
CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
ADAT | BODY WIDTH | 0.265 INCHES MINIMUM AND 0.325 INCHES MAXIMUM |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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