NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , DIGITAL
Definition:
A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 20068-99 | 04713 | A | 5 | 2 | 5 | TX | ||
| 348827 | 3B150 | A | 5 | 1 | 5 | ZZ | ||
| DMS 80015B | 16236 | A | 5 | 9 | 9 | TX | ||
| 348827 | 49956 | A | 5 | 9 | 5 | TA | ||
| MC799P | 04713 | A | E | 8 | 4 | 75 | ||
| 20068-99 | 25420 | A | 3 | 2 | 1 | TA | ||
| MC899L | 04713 | A | 5 | 2 | 3 | TX |
CAGE Information
| Code | Company |
|---|---|
| 04713 | FREESCALE SEMICONDUCTOR INC. |
| 3B150 | RAYTHEON TECHNICAL SERVICES COMPANY |
| 16236 | DLA LAND AND MARITIME |
| 49956 | RAYTHEON COMPANY DBA RAYTHEON |
| 25420 | MOTOROLA/CODEX CORP SUB OF MOTOROLA |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| TEST | TEST DATA DOCUMENT | 25420-20068 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CSSL | DESIGN FUNCTION AND QUANTITY | 2 BUFFER |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND MEDIUM POWER AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND HERMETICALLY SEALED AND MEDIUM SPEED |
| CZEQ | TIME RATING PER CHACTERISTIC | 32.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 28.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 4.0 VOLTS MAXIMUM POWER SOURCE |
| CQWX | OUTPUT LOGIC FORM | RESISTOR-TRANSISTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CQZP | INPUT CIRCUIT PATTERN | DUAL 2 INPUT |
| ADAQ | BODY LENGTH | 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
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