NIIN Output Data
NIIN:
NSN:
Item Name:
SEMICONDUCTOR DEVICE , DIODE
Definition:
A TWO ELECTRODE SEMICONDUCTOR DEVICE HAVING AN ASYMMETRICAL VOLTAGE - CURRENT CHARACTERISTIC. MAY OR MAY NOT INCLUDE MOUNTING HARDWARE AND/OR HEATSINK. EXCLUDES LIGHT EMITTING DIODE AND SEMICONDUCTOR DEVICE,PHOTO. FOR ITEMS CONTAINING MATERIAL SUCH AS SELENIUM AND COPPER OXIDE, SEE RECIFIER, METALLIC.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| UTR286 | 12969 | A | 5 | 2 | 5 | TX | ||
| SMB524851-4 | 80063 | A | 3 | 2 | 1 | TX | ||
| SES521 | 31338 | A | 5 | 2 | 5 | TX |
CAGE Information
| Code | Company |
|---|---|
| 12969 | MICRO USPD INC |
| 80063 | US ARMY COMMUNICATIONS & ELECTRONICS |
| 31338 | SEMITRONICS CORP |
Federal Supply Class
Title
SEMICONDUCTOR DEVICES AND ASSOCI
Inclusions:
INCLUDES SEMICONDUCTOR ASSEMBLIES; SEMICONDUCTOR DIODES; SEMICONDUCTOR RECTIFIERS, SEMICONDUCTOR THYRISTORS; TRANSISTORS; UNITIZED SEMICONDUCTORS; ASSOCIATED HARDWARE EXCEPT SOCKETS.
Exclusions:
EXCLUDES MICROCIRCUITS; OPTOELECTRONIC DEVICES AND ASSOCIATED HARDWARE.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AXGY | MOUNTING METHOD | TERMINAL |
| AXGY | MOUNTING METHOD | TERMINAL |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 3.00 MICROAMPERES FORWARD CURRENT, AVERAGE MAJOR |
| ABBH | INCLOSURE MATERIAL | GLASS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| ABJT | TERMINAL LENGTH | 0.700 INCHES MINIMUM |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 95.0 DEG CELSIUS AMBIENT AIR |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 50.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| ABHP | OVERALL LENGTH | 0.250 INCHES MAXIMUM |