NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
N8290N | 18324 | A | 3 | 2 | 1 | TX | ||
868290 | 14632 | A | 5 | 2 | 1 | TX | ||
USN8290A | 56289 | A | 3 | 2 | 3 | TX | ||
N8290A | 18324 | A | 5 | 9 | 3 | TX | ||
DM8290N | 27014 | A | 5 | 9 | 5 | TX | ||
RC8290A | 3B150 | A | 3 | 2 | 3 | TX | ||
DM8290AN | 27014 | A | 5 | 9 | 3 | TX | ||
RC8290A | 49956 | A | 5 | 9 | 3 | TX | ||
8290A | 18324 | A | 3 | 2 | 4 | 92 |
CAGE Information
Code | Company |
---|---|
14632 | DRS SIGNAL SOLUTIONS INC. |
18324 | PHILIPS SEMICONDUCTORS INC |
56289 | SPRAGUE ELECTRIC CO WORLD HQS |
27014 | NATIONAL SEMICONDUCTOR CORPORATION |
3B150 | RAYTHEON TECHNICAL SERVICES COMPANY |
49956 | RAYTHEON COMPANY DBA RAYTHEON |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HIGH SPEED AND PROGRAMMABLE AND RESETTABLE AND DC COUPLED AND PRESETTABLE AND W/STROBE AND W/ENABLE AND POSITIVE OUTPUTS AND MONOLITHIC AND W/CLEAR |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CRHL | BIT QUANTITY (NON-CORE) | 10 |
ADAU | BODY HEIGHT | 0.125 INCHES MINIMUM AND 0.135 INCHES MAXIMUM |
CQSJ | INCLOSURE MATERIAL | RESIN |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
CZER | MEMORY DEVICE TYPE | ROM |
ADAQ | BODY LENGTH | 0.770 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 150.0 MILLIWATTS |
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.255 INCHES MAXIMUM |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |