NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
1816-0018 | 34649 | A | 5 | 9 | 5 | TX | ||
AM27S20PC | 34335 | A | 5 | 1 | 3 | TX | ||
1816-0018 | 28480 | A | 5 | 9 | 3 | TX | ||
DM74S387N | 27014 | A | 5 | 9 | 3 | TX | ||
6300-1 | 50364 | F | 5 | 1 | 3 | TX | ||
N82S126N | 18324 | A | 5 | 1 | 3 | TX | ||
1816-0018 | 1LQK8 | A | 3 | 2 | 5 | ZZ | ||
93417PC | 07263 | A | 5 | 1 | 3 | TX |
CAGE Information
Code | Company |
---|---|
07263 | FAIRCHILD SEMICONDUCTOR CORP |
34649 | INTEL CORP SALES OFFICE |
34335 | ADVANCED MICRO DEVICES, INC. DBA A M |
28480 | HEWLETT PACKARD CO |
27014 | NATIONAL SEMICONDUCTOR CORPORATION |
50364 | MMI/AMD |
18324 | PHILIPS SEMICONDUCTORS INC |
1LQK8 | AGILENT TECHNOLOGIES INC. DIV AGILEN |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
AEHX | MAXIMUM POWER DISSIPATION RATING | 625.0 MILLIWATTS |
CBBL | FEATURES PROVIDED | PROGRAMMABLE AND W/ENABLE AND MONOLITHIC AND POSITIVE OUTPUTS AND HERMETICALLY SEALED AND PROGRAMMED |
TEST | TEST DATA DOCUMENT | 28480-A-1816-9003-1 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
AGAV | END ITEM IDENTIFICATION | RECEIVING @FACILITY,SPECIAL PURPOSE TYPE AN/FSQ-91(V) FSCM 91417 |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CRHL | BIT QUANTITY (NON-CORE) | 1024 |
CZZZ | MEMORY CAPACITY | UNKNOWN |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 0.896 INCHES MAXIMUM |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
CZER | MEMORY DEVICE TYPE | ROM |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CSWJ | WORD QUANTITY (NON-CORE) | 256 |