NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| MCM93425DM | 04713 | A | 5 | 2 | 6 | TX | ||
| N82S93425AF | 18324 | A | C | 1 | 3 | TX | AF | |
| 52SPL-93425 | 57230 | F | 3 | 9 | 1 | TX | ||
| 93425DC | 07263 | A | C | 1 | 3 | TX | AF | |
| ES 52SPL-93425 | 57230 | F | 5 | 2 | 1 | TX | ||
| 93425DM | 07263 | A | 5 | 2 | 6 | TX |
CAGE Information
| Code | Company |
|---|---|
| 04713 | FREESCALE SEMICONDUCTOR INC. |
| 18324 | PHILIPS SEMICONDUCTORS INC |
| 57230 | GOULD INC SIMULATION SYSTEMS DIV |
| 07263 | FAIRCHILD SEMICONDUCTOR CORP |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| ADAU | BODY HEIGHT | 0.150 INCHES MINIMUM AND 0.200 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.770 INCHES MAXIMUM |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| ADAT | BODY WIDTH | 0.285 INCHES MINIMUM AND 0.291 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | W/ENABLE AND W/DISABLE AND W/DECODED OUTPUT AND W/BUFFERED OUTPUT AND POSITIVE OUTPUTS AND BIPOLAR AND HERMETICALLY SEALED AND 3-STATE OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 835.0 MILLIWATTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| AFGA | OPERATING TEMP RANGE | +0.0/+75.0 DEG CELSIUS |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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MCM93425DM ,
MCM93425DM ,
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5962010491498 ,
010491498
,
MCM93425DM ,
N82S93425AF ,
52SPL-93425 ,
93425DC ,
ES 52SPL-93425 ,
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