NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| FC3351-1DM-1 | 58625 | A | 5 | 9 | E | TX | ||
| DMS 88020B | 16236 | A | 5 | 9 | 9 | TX | ||
| SS31811-102 | U2248 | A | 5 | 2 | 2 | ZK | ||
| ISI3351-1DMQB | 0H661 | F | 5 | 1 | 5 | TX | ||
| 33511DMQB | 13715 | F | 3 | 9 | 3 | TX |
CAGE Information
| Code | Company |
|---|---|
| 0H661 | U S ENVIRONMENTAL PROTECTION AGENCY |
| 58625 | LANSDALE SEMICONDUCTOR INC. |
| 16236 | DLA LAND AND MARITIME |
| U2248 | SELEX ELSAG LTD |
| 13715 | FAIRCHILD SEMICONDUCTOR CORP COMPONE |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| AGAV | END ITEM IDENTIFICATION | B-52G/H WST 36378 |
| CZER | MEMORY DEVICE TYPE | FIRST-IN FIRST-OUT |
| CRHL | BIT QUANTITY (NON-CORE) | 360 |
| CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| ADAU | BODY HEIGHT | 0.110 INCHES MINIMUM AND 0.160 INCHES MAXIMUM |
| CSWJ | WORD QUANTITY (NON-CORE) | 40 |
| AFJQ | STORAGE TEMP RANGE | -55.0/+150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CBBL | FEATURES PROVIDED | W/ENABLE AND EXPANDABLE AND ASYNCHRONOUS AND HERMETICALLY SEALED AND 3-STATE OUTPUT |
| ADAQ | BODY LENGTH | 1.490 INCHES MINIMUM AND 1.510 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.565 INCHES MINIMUM AND 0.590 INCHES MAXIMUM |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -20.0 VOLTS MINIMUM POWER SOURCE AND 0.3 VOLTS MAXIMUM POWER SOURCE |