NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| SK010296 | 36378 | R | D | 9 | A | TX | ||
| 4014666-764 | 1PQF4 | A | C | 1 | 5 | ZZ | 9F | |
| 7758046-947 | 36378 | R | 5 | 9 | 5 | TX | ||
| 4014666-764 | 36378 | R | 3 | 9 | 5 | TX | ||
| ROM/PROM FAMILY 007 | 16236 | A | 5 | 1 | 5 | TX | ||
| S82S185F | 18324 | A | 5 | 1 | E | TX |
CAGE Information
| Code | Company |
|---|---|
| 16236 | DLA LAND AND MARITIME |
| 36378 | RAYTHEON TECHNICAL SERVICES COMPANY |
| 1PQF4 | L-3 COMMUNICATIONS CORPORATION DIV L |
| 18324 | PHILIPS SEMICONDUCTORS INC |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| ADAQ | BODY LENGTH | 0.882 INCHES MINIMUM AND 0.925 INCHES MAXIMUM |
| CRHL | BIT QUANTITY (NON-CORE) | 8192 |
| ADAU | BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| ADAT | BODY WIDTH | 0.302 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| CBBL | FEATURES PROVIDED | 3-STATE OUTPUT AND PROGRAMMABLE AND BIPOLAR AND HERMETICALLY SEALED AND W/ENABLE |
| CSWJ | WORD QUANTITY (NON-CORE) | 2048 |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |