NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
HM7611 | 34371 | A | 5 | 9 | 5 | TX | ||
M3621 | 34649 | A | 5 | 1 | E | TX | ||
82S129 | 18324 | A | 5 | 1 | E | TX | ||
93427 | 07263 | A | 5 | 1 | E | TX | ||
5301-1 | 50364 | F | 5 | 1 | E | TX | ||
108626 | 09BZ2 | A | 5 | 2 | 6 | ZZ | ||
IM5623 | 32293 | F | 5 | 1 | E | TX | ||
108626 | 19059 | A | 3 | 9 | 6 | TX | ||
ROM/PROM FAMILY 005 | 16236 | A | 5 | 1 | 5 | TX | ||
AM27S11 | 34335 | A | 5 | 9 | E | TX |
CAGE Information
Code | Company |
---|---|
07263 | FAIRCHILD SEMICONDUCTOR CORP |
34371 | INTERSIL CORPORATION |
34649 | INTEL CORP SALES OFFICE |
18324 | PHILIPS SEMICONDUCTORS INC |
50364 | MMI/AMD |
09BZ2 | RUGGED INFORMATION TECHNOLOGY EQUIPM |
32293 | INTERSIL INC SUB OF GENERAL ELECTRIC |
19059 | DATAMETRICS CORPORATION |
16236 | DLA LAND AND MARITIME |
34335 | ADVANCED MICRO DEVICES, INC. DBA A M |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND SCHOTTKY AND PROGRAMMABLE AND 3-STATE OUTPUT |
AEHX | MAXIMUM POWER DISSIPATION RATING | 307.2 MILLIWATTS |
CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
ADAQ | BODY LENGTH | 0.740 INCHES MINIMUM AND 0.810 INCHES MAXIMUM |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CRHL | BIT QUANTITY (NON-CORE) | 1024 |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CZER | MEMORY DEVICE TYPE | ROM |
ADAU | BODY HEIGHT | 0.140 INCHES MAXIMUM |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
ADAT | BODY WIDTH | 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
CSWJ | WORD QUANTITY (NON-CORE) | 256 |
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,
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