NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , DIGITAL
Definition:
A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 5962-3833002BDA | 81349 | M | 5 | 1 | E | TX | ||
| M38510/33002BDA | 81349 | M | 2 | 2 | E | TX | ||
| A584A344-165 | 88818 | A | E | 8 | 5 | MF | ||
| M38510/33002BAX | 81349 | M | 5 | 9 | E | TX | ||
| MIL-M-38510/330 | 81349 | M | 4 | 1 | 4 | TX | ||
| 5962-3833002BDB | 81349 | M | 5 | 9 | E | TX | ||
| 5962-3833002BDX | 81349 | M | 5 | 9 | E | TX |
CAGE Information
| Code | Company |
|---|---|
| 81349 | MILITARY SPECIFICATIONS PROMULGATED |
| 88818 | KEARFOTT CORPORATION DBA KEARFOTT DI |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CSSL | DESIGN FUNCTION AND QUANTITY | 6 INVERTER |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CZEQ | TIME RATING PER CHACTERISTIC | 7.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 6.50 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| CQZP | INPUT CIRCUIT PATTERN | HEX 1 INPUT |
| ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/330 GOVERNMENT SPECIFICATION |
| CBBL | FEATURES PROVIDED | SCHOTTKY AND MONOLITHIC AND HERMETICALLY SEALED |
| FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS CRITICAL ITEMS3 |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| ADAT | BODY WIDTH | 0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 84.0 MILLIWATTS |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| ADAQ | BODY LENGTH | 0.390 INCHES MAXIMUM |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-2 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |