NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| MD2764A-25/B | 34649 | A | 5 | 1 | 6 | TX | ||
| A-2502-A-3469 | 33472 | A | C | 1 | 6 | ZZ | AC | |
| AM2764A-25/BXA | 34335 | A | 5 | 9 | 6 | TX | ||
| ROM/PROM FAMILY 040 | 16236 | A | 5 | 1 | 9 | TX | ||
| AM2764DC | 34335 | A | 5 | 9 | E | TX | ||
| QD2764 | 34649 | A | 5 | 9 | E | TX | ||
| A-2502-A-3469 | 50406 | A | 3 | 2 | 5 | TX | ||
| ROM/PROM | 16236 | A | 5 | 1 | 6 | TX |
CAGE Information
| Code | Company |
|---|---|
| 16236 | DLA LAND AND MARITIME |
| 34649 | INTEL CORP SALES OFFICE |
| 33472 | BOEING COMPANY THE DBA BOEING DIV DE |
| 34335 | ADVANCED MICRO DEVICES, INC. DBA A M |
| 50406 | ARGON ST INC. |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| ADAT | BODY WIDTH | 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| ADAU | BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.187 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -0.0/+70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CSWJ | WORD QUANTITY (NON-CORE) | 8192 |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CBBL | FEATURES PROVIDED | W/ENABLE AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND LOW CURRENT |
| ADAQ | BODY LENGTH | 1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM |
| CRHL | BIT QUANTITY (NON-CORE) | 65536 |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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,
MD2764A-25/B ,
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