NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| AM27S191A/LMC | 34335 | A | 5 | 9 | E | TX | ||
| 8505758-791 | 07187 | A | 3 | 9 | 5 | TX | ||
| AM27S191A/BUA | 34335 | A | 5 | 9 | 5 | TX | ||
| ROM/PROM HEAD 108 | 16236 | A | 5 | 1 | 9 | TX | ||
| G104670-834 | 49956 | A | C | 1 | 6 | ZZ | AC |
CAGE Information
| Code | Company |
|---|---|
| 07187 | HONEYWELL INTERNATIONAL INC DBA HONE |
| 34335 | ADVANCED MICRO DEVICES, INC. DBA A M |
| 16236 | DLA LAND AND MARITIME |
| 49956 | RAYTHEON COMPANY DBA RAYTHEON |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| ADAQ | BODY LENGTH | 0.550 INCHES MAXIMUM |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| ADAT | BODY WIDTH | 0.450 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CRHL | BIT QUANTITY (NON-CORE) | 16384 |
| CBBL | FEATURES PROVIDED | 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CSWJ | WORD QUANTITY (NON-CORE) | 2048 |
| CZER | MEMORY DEVICE TYPE | ROM |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |