NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
7100582-1 | 10236 | A | 3 | 2 | A | TX | ||
X2864AEMB-45 | 60395 | A | 5 | 2 | 6 | TX | ||
ROM/PROM | 16236 | A | 5 | 1 | 6 | TX |
CAGE Information
Code | Company |
---|---|
10236 | ELECTRODYNAMICS INC. DBA L-3 COMMUNI |
60395 | XICOR INC |
16236 | DLA LAND AND MARITIME |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
CQZP | INPUT CIRCUIT PATTERN | 24 INPUT |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE AND W/BUFFERED OUTPUT AND BIDIRECTIONAL |
TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
ADAT | BODY WIDTH | 0.450 INCHES MAXIMUM |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
AEHX | MAXIMUM POWER DISSIPATION RATING | 750.0 MILLIWATTS |
CSWJ | WORD QUANTITY (NON-CORE) | 8192 |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
CRHL | BIT QUANTITY (NON-CORE) | 65536 |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CZER | MEMORY DEVICE TYPE | ROM |
ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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ROM/PROM ,