NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| CY7C167-55DMB | 65786 | A | 5 | 9 | E | TX | ||
| 7909559-45 | 90536 | A | 3 | 2 | A | TX | ||
| UPD2167 | 4T165 | F | 5 | 9 | 6 | TX | ||
| IDT6167LA55LB | 61772 | A | 5 | 2 | E | TX | ||
| 795066-1 | 73030 | A | C | 1 | 5 | ZZ | AF |
CAGE Information
| Code | Company |
|---|---|
| 4T165 | NEC ELECTRONICS U S A INC ELECTRON D |
| 65786 | CYPRESS SEMICONDUCTOR CORPORATION |
| 90536 | LOCKHEED MARTIN CORPORATION DBA LOCK |
| 61772 | INTEGRATED DEVICE TECHNOLOGY INC |
| 73030 | HAMILTON SUNDSTRAND CORPORATION |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| ADAQ | BODY LENGTH | 0.425 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE |
| CZEQ | TIME RATING PER CHACTERISTIC | 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CSWJ | WORD QUANTITY (NON-CORE) | 16384 |
| CRHL | BIT QUANTITY (NON-CORE) | 16384 |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| ADAT | BODY WIDTH | 0.290 INCHES NOMINAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CZER | MEMORY DEVICE TYPE | RAM |
| ADAU | BODY HEIGHT | 0.065 INCHES NOMINAL |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
Similar Parts
UPD2167 ,
UPD2167 ,
5962-01-267-8169 ,
5962012678169 ,
012678169
,
CY7C167-55DMB ,
7909559-45 ,
UPD2167 ,
IDT6167LA55LB ,
795066-1 ,