NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 168999-03 | 35351 | A | C | 1 | 5 | TX | AF | |
| IDT71256L150L32B | 61772 | A | 5 | 9 | 5 | TX | ||
| IDT71256L55L32B | 61772 | A | 5 | 2 | E | TX | ||
| EDI8832C55LB | 54230 | A | C | 1 | 5 | ZZ | 9X | |
| 717801459-001 | 04939 | A | 3 | 2 | A | TX | ||
| 5962-8855203YX | 16236 | A | C | 1 | 3 | ZZ | AC | |
| MB84256-15CV-W-SC | 61271 | A | C | 1 | 5 | TX | AF | |
| EDI8832C55LB | 66301 | F | 5 | 9 | 6 | TX |
CAGE Information
| Code | Company |
|---|---|
| 04939 | LOCKHEED MARTIN CORPORATION DBA LOCK |
| 35351 | GE AVIATION SYSTEMS LLC |
| 61772 | INTEGRATED DEVICE TECHNOLOGY INC |
| 54230 | WHITE ELECTRONIC DESIGNS CORPORATION |
| 16236 | DLA LAND AND MARITIME |
| 61271 | FUJITSU MICROELECTRONICS INC. |
| 66301 | WHITE ELECTRONIC DESIGNS CORP DIV CO |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
| ADAT | BODY WIDTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CSWJ | WORD QUANTITY (NON-CORE) | 32768 |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510 |
| CZEQ | TIME RATING PER CHACTERISTIC | 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CZER | MEMORY DEVICE TYPE | RAM |
| CRHL | BIT QUANTITY (NON-CORE) | 262144 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND BURN IN AND BIDIRECTIONAL AND W/ENABLE |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |