NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , DIGITAL
Definition:
A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| MIL-M-38510/347 | 81349 | M | 4 | 1 | E | TX | ||
| M38510/34701B2A | 81349 | M | 2 | 2 | E | TX | ||
| M38510/34701B2B | 81349 | M | 5 | 9 | E | TX | ||
| G279018-852 | 49956 | A | C | 1 | 5 | TX | AF | |
| M38510/34701B2X | 81349 | M | 5 | 9 | E | TX | ||
| 6134557-3 | 03640 | A | C | 1 | 6 | ZZ | AC |
CAGE Information
| Code | Company |
|---|---|
| 03640 | LOCKHEED MARTIN CORPORATION DBA LOCK |
| 81349 | MILITARY SPECIFICATIONS PROMULGATED |
| 49956 | RAYTHEON COMPANY DBA RAYTHEON |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION |
| ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 176.0 MILLIWATTS |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 COMPARATOR |
| ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | BURN IN AND HERMETICALLY SEALED AND SCHOTTKY AND MONOLITHIC |
| CZEQ | TIME RATING PER CHACTERISTIC | 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/347 GOVERNMENT SPECIFICATION |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CRHL | BIT QUANTITY (NON-CORE) | 8 |