NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
AM2149-55/BVA | 34335 | A | E | 8 | 5 | TX | ||
A3061056-001 | 80063 | A | E | 8 | A | TX | ||
QD2149H-2 | 34649 | A | 5 | 9 | E | TX | ||
5542925 | 53711 | A | 3 | 2 | A | TX | ||
CY2149-45DMB | 65786 | A | 5 | 2 | 5 | ZZ | ||
AM2149-45/BVA | 0HW02 | H | 5 | 9 | E | ZZ |
CAGE Information
Code | Company |
---|---|
0HW02 | MSIS SEMICONDUCTOR INC |
34335 | ADVANCED MICRO DEVICES, INC. DBA A M |
80063 | US ARMY COMMUNICATIONS & ELECTRONICS |
34649 | INTEL CORP SALES OFFICE |
53711 | NAVAL SEA SYSTEMS COMMAND |
65786 | CYPRESS SEMICONDUCTOR CORPORATION |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
ADAU | BODY HEIGHT | 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
CRHL | BIT QUANTITY (NON-CORE) | 4096 |
CZZZ | MEMORY CAPACITY | UNKNOWN |
CBBL | FEATURES PROVIDED | BURN IN AND HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND MONOLITHIC |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CZER | MEMORY DEVICE TYPE | RAM |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
ABKW | OVERALL HEIGHT | 0.400 INCHES MAXIMUM |
TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
CSWJ | WORD QUANTITY (NON-CORE) | 1024 |
ADAQ | BODY LENGTH | 0.960 INCHES MAXIMUM |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-6 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
Similar Parts
AM2149-45/BVA ,
AM214945BVA ,
5962-01-321-1949 ,
5962013211949 ,
013211949
,
AM2149-55/BVA ,
A3061056-001 ,
QD2149H-2 ,
5542925 ,
CY2149-45DMB ,
AM2149-45/BVA ,