NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
AT27C512-20DM/883 | 1FN41 | A | 5 | 1 | 5 | TU | ||
DR521-1512-002H | K1066 | A | 5 | 2 | 4 | ZK | ||
WS27C512L-20DMB | 66579 | A | 5 | 1 | 5 | TU | ||
5962-87648 | 67268 | A | 4 | 1 | E | TX | ||
5962-8764802XX | 16236 | A | C | 1 | 6 | ZZ | AC | |
SMJ27C512-20JM | 01295 | A | 5 | 1 | E | ZZ | ||
AM27C512-200/BXA | 34335 | A | 5 | 9 | 5 | TU | ||
5962-8764802XB | 67268 | A | 5 | 9 | E | TX | ||
5962-8764802XX | 67268 | A | 5 | 9 | E | TX | ||
MD27C512-20DB | 34649 | A | 5 | 1 | 5 | TU | ||
27C512-20MR/J | 60991 | Y | 5 | 1 | 5 | TU | ||
5962-8764802XA | 67268 | A | 2 | 2 | E | TX | ||
27C512/BXA-20 | 18324 | A | 5 | 1 | 5 | TU | ||
ROM/PROM | 16236 | A | 5 | 1 | 9 | ZZ |
CAGE Information
Code | Company |
---|---|
01295 | TEXAS INSTRUMENTS INCORPORATED DBA T |
1FN41 | ATMEL CORPORATION |
K1066 | SELEX GALILEO LTD |
66579 | WAFERSCALE INTEGRATION INC |
67268 | DLA LAND AND MARITIME OPNS SUPPORT G |
16236 | DLA LAND AND MARITIME |
34335 | ADVANCED MICRO DEVICES, INC. DBA A M |
34649 | INTEL CORP SALES OFFICE |
60991 | MICROCHIP TECHNOLOGY INC |
18324 | PHILIPS SEMICONDUCTORS INC |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
CZER | MEMORY DEVICE TYPE | EPROM |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
FEAT | SPECIAL FEATURES | TRANSPARENT LID TO PERMIT ULTRAVIOLET LIGHT ERASURE |
CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
AEHX | MAXIMUM POWER DISSIPATION RATING | 350.0 MILLIWATTS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
CRHL | BIT QUANTITY (NON-CORE) | 65536 |
CBBL | FEATURES PROVIDED | MONOLITHIC AND ULTRAVIOLET ERASABLE |
CTQX | CURRENT RATING PER CHARACTERISTIC | 60.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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,
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