NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| IDT71256S70DB | 61772 | A | 5 | 2 | 5 | TX | ||
| 13211843-01 | 30003 | A | 3 | 2 | A | TX | ||
| 71256S70DB | 61772 | A | 5 | 2 | 5 | TX | ||
| VA-85-1759-001 | K0668 | A | 5 | 2 | 2 | ZK | ||
| EDH8832C-70 DMHR | 66301 | F | 5 | 9 | 5 | TX | ||
| 5962-8866202XX | U2266 | A | 5 | 2 | 9 | ZK |
CAGE Information
| Code | Company |
|---|---|
| 30003 | NAVAL AIR SYSTEMS COMMAND |
| 61772 | INTEGRATED DEVICE TECHNOLOGY INC |
| K0668 | SELEX GALILEO LTD DBA SELEX S & A S |
| 66301 | WHITE ELECTRONIC DESIGNS CORP DIV CO |
| U2266 | HARRIS SYSTEMS LTD |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| ADAQ | BODY LENGTH | 1.440 INCHES MINIMUM AND 1.490 INCHES MAXIMUM |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| CBBL | FEATURES PROVIDED | STATIC OPERATION AND HIGH PERFORMANCE AND HIGH SPEED |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CSWJ | WORD QUANTITY (NON-CORE) | 32768 |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 300.0 MILLIWATTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
| CRHL | BIT QUANTITY (NON-CORE) | 262144 |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CZER | MEMORY DEVICE TYPE | ROM |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |