NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 312A5749P1 | 61772 | A | 5 | 1 | 5 | TX | ||
| NH312A5749P1 | 16236 | A | 5 | 1 | 5 | TX | ||
| 312A5749P1 | 75569 | A | 5 | 1 | 5 | TX | ||
| P4C187-25LMB54 | 75569 | A | 5 | 1 | 5 | TX | ||
| P4C187-25LMB | 75569 | A | C | 1 | 5 | TX | AF | |
| 312A5749P1 | 89954 | A | 3 | 2 | A | TX | ||
| IDT7187S25L22B | 61772 | A | C | 1 | E | TX | AF |
CAGE Information
| Code | Company |
|---|---|
| 16236 | DLA LAND AND MARITIME |
| 61772 | INTEGRATED DEVICE TECHNOLOGY INC |
| 75569 | PERFORMANCE SEMICONDUCTOR CORP |
| 89954 | BAE SYSTEMS CONTROLS INC. DBA PLATFO |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.480 INCHES MINIMUM AND 0.496 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.054 INCHES MINIMUM AND 0.063 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| ABMK | OVERALL WIDTH | 0.284 INCHES MINIMUM AND 0.296 INCHES MAXIMUM |
| FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS CRITICAL ITEM |
| CSWJ | WORD QUANTITY (NON-CORE) | 65536 |
| ADAT | BODY WIDTH | 0.284 INCHES MINIMUM AND 0.296 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| TTQY | TERMINAL TYPE AND QUANTITY | 22 LEADLESS |
| CBBL | FEATURES PROVIDED | BURN IN AND HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE AND STATIC OPERATION |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| ADAQ | BODY LENGTH | 0.480 INCHES MINIMUM AND 0.496 INCHES MAXIMUM |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
| CRHL | BIT QUANTITY (NON-CORE) | 65536 |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 8.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 105.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| CQZP | INPUT CIRCUIT PATTERN | 19 INPUT |
| CRTL | CRITICALITY CODE JUSTIFICATION | FEAT |
| CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM ACCESS |
| ABKW | OVERALL HEIGHT | 0.054 INCHES MINIMUM AND 0.063 INCHES MAXIMUM |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |