NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 5962-3829419MUA | 67268 | A | 2 | 2 | E | ZZ | ||
| 5962-38294 | 67268 | A | 4 | 1 | E | ZZ | ||
| L7C185KMB | 65896 | A | 5 | 9 | E | ZZ | ||
| 5962-3829419MUB | 67268 | A | 5 | 9 | E | ZZ | ||
| 5962-3829419MUX | 67268 | A | 5 | 9 | E | ZZ | ||
| MT5C6408EC-15 | 6Y440 | A | 5 | 1 | E | ZZ |
CAGE Information
| Code | Company |
|---|---|
| 65896 | LOGIC DEVICES INCORPORATED |
| 67268 | DLA LAND AND MARITIME OPNS SUPPORT G |
| 6Y440 | MICRON TECHNOLOGY INC. |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| ADAT | BODY WIDTH | 11.23 MILLIMETERS MINIMUM AND 11.68 MILLIMETERS MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| ADAU | BODY HEIGHT | 1.52 MILLIMETERS MINIMUM AND 2.54 MILLIMETERS MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CSWJ | WORD QUANTITY (NON-CORE) | 8192 |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 0.5 VOLTS MAXIMUM INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 150.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
| CRHL | BIT QUANTITY (NON-CORE) | 65536 |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CZER | MEMORY DEVICE TYPE | RAM |
| ADAQ | BODY LENGTH | 11.23 MILLIMETERS MINIMUM AND 11.68 MILLIMETERS MAXIMUM |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |