NIIN Output Data
Definition:
A GROUPING OF TWO OR MORE SEMICONDUCTING DEVICES SUCH AS LIGHT EMITTING DIODE; SEMICONDUCTOR DEVICE, DIODE; SEMICONDUCTOR DEVICE, PHOTO; SEMICONDUCTOR DEVICE, THYRISTOR; AND/OR TRANSISTOR MOUNTED ON A COMMON MOUNTING OR MOUNTED ON EACH OTHER. THE DEVICES MUST BE SEPARABLE AND EACH ITEM MUST BE CAPABLE OF FUNCTIONING IN ACCORDANCE WITH ITS GIVEN NAME. FOR ASSEMBLIES CONSISTING OF SEMICONDUCTING DEVICES PERMANENTLY CASED, ENCAPSULATED, OR POTTED TOGETHER TO FORM A SINGLE UNIT, SEE RECTIFIER, SEMICONDUCTOR DEVICE, UNITIZED AND SEMICONDUCTOR DEVICES, UNITIZED. EXCLUDES SEMICONDUCTOR DEVICE SET; MICROCIRCUIT ASSEMBLY; AND MICROCIRCUIT SET. SEE ALSO ABSORBER, OVERVOLTAGE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
VG021042-001 | 51215 | A | 5 | 9 | 2 | ZZ | ||
VG021104-001 | 51215 | A | 3 | 2 | 5 | ZZ |
CAGE Information
Code | Company |
---|---|
51215 | BOEING COMPANY THE DBA BOEING DIV DE |
Federal Supply Class
Title
SEMICONDUCTOR DEVICES AND ASSOCI
Inclusions:
INCLUDES SEMICONDUCTOR ASSEMBLIES; SEMICONDUCTOR DIODES; SEMICONDUCTOR RECTIFIERS, SEMICONDUCTOR THYRISTORS; TRANSISTORS; UNITIZED SEMICONDUCTORS; ASSOCIATED HARDWARE EXCEPT SOCKETS.
Exclusions:
EXCLUDES MICROCIRCUITS; OPTOELECTRONIC DEVICES AND ASSOCIATED HARDWARE.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
AGAV | END ITEM IDENTIFICATION | AGM 130 |
AEAS | MAJOR COMPONENTS | DIODE 17,PRINTED WIRING BOARD 1, COONECTOR 2 |