NIIN Output Data
NIIN:
NSN:
Item Name:
MICROCIRCUIT , DIGITAL
Definition:
A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 5962-88651022B | 67268 | A | 5 | 9 | E | ZZ | ||
| 5962-88651022C | 67268 | A | 5 | 9 | E | ZZ | ||
| 5962-88651022X | 67268 | A | 5 | 9 | E | ZZ | ||
| 5962-88651 | 67268 | A | 4 | 1 | E | ZZ | ||
| P54PCT533ALMB | 75569 | A | 5 | 1 | 5 | ZZ | ||
| 5962-88651022A | 67268 | A | 2 | 2 | E | ZZ | ||
| IDT54FCT533ALB | 61772 | A | 5 | 1 | 5 | ZZ |
CAGE Information
| Code | Company |
|---|---|
| 61772 | INTEGRATED DEVICE TECHNOLOGY INC |
| 67268 | DLA LAND AND MARITIME OPNS SUPPORT G |
| 75569 | PERFORMANCE SEMICONDUCTOR CORP |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| ADAQ | BODY LENGTH | 0.358 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.358 INCHES NOMINAL |
| CSSL | DESIGN FUNCTION AND QUANTITY | 8 LATCH |
| ADAU | BODY HEIGHT | 0.100 INCHES NOMINAL |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 6.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, DIGITAL, FAST, CMOS, OCTAL TRANSPARENT LATCHES, MONOLITHIC SILICON |
| CBBL | FEATURES PROVIDED | BURN IN AND MONOLITHIC AND 3-STATE OUTPUT AND HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |