NIIN Output Data
NIIN:
NSN:
Item Name:
BACKPLANE ASSEMBLY
Definition:
AN INSULATING PANEL UPON WHICH TWO OR MORE CONNECTOR, RECEPTACLE, ELECTRICAL, ARE MOUNTED, AND COMPLETELY PROCESSED ELECTRICAL CONDUCTOR PATHS ARE DEPOSITED, ETCHED, OR PRINTED IN VARIOUS PATHS. IT PROVIDES OR COMPLETES A CIRCUIT BETWEEN TWO OR MORE CIRCUIT CARD ASSEMBLY OR ELECTRONIC COMPONENTS ASSEMBLY. IT MAY BE DESIGNED FOR PANEL OR CHASSIS MOUNTING, OR FOR INSERTION INTO A CONNECTOR, RECEPTACLE, ELECTRICAL. INCLUDES MOTHERBOARDS. FOR ITEMS CONTAINING PROCESSED ELECTRICAL CONDUCTOR PATHS AND CONTACTS FOR PLUG-IN CONNECTING FACILITIES, SEE PRINTED WIRING BOARD. SEE ALSO PRINTED CIRCUIT BOARD; CIRCUIT CARD ASSEMBLY AND CABLE ASSEMBLY, PRINTED, FLEXIBLE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 95001066 | 64869 | A | 3 | 2 | 4 | 9Z |
CAGE Information
| Code | Company |
|---|---|
| 64869 | FLIR SYSTEMS INC. DIV CORPORATE |
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | CENTRAL ELECTRONICS UNIT |
| AGAV | END ITEM IDENTIFICATION | USED ON MOTHERBOARD/CONTROL FOR RDAF SAPPHIRE THERMAL IMAGING SYSTEM |