NIIN Output Data
Definition:
TWO OR MORE DIODE SEMICONDUCTOR DEVICES DESIGNED TO FUNCTION AS A UNIT IN CHANGING ALTERNATING CURRENT TO DIRECT CURRENT. THE DIODE DEVICES ARE INTERNALLY CONNECTED IN SERIES, AND ARE PERMANENTLY CASED, ENCAPSULATED, POTTED, OR MOLDED TOGETHER TO FORM AN INSEPARABLE UNIT. THESE UNITS MAY BE DESIGNED AS EITHER HALF-WAVE OR FULL-WAVE RECTIFIERS AND MAY BE MOUNTED TO FORM EITHER SINGLE PHASE OR THREE PHASE BRIDGES. FOR INTERCONNECTED ITEMS ARRANGED IN STACK(S), SEE RECTIFIER, SEMICONDUCTOR DEVICE. FOR ITEMS FABRICATED IN THE FORM OF A MONOLITHIC OR THIN FILM STRUCTURE THAT PERFORM THE FUNCTION OF A CIRCUIT, SEE INTEGRATED CIRCUIT (AS MODIFIED). EXCLUDES SEMICONDUCTOR DEVICES, UNITIZED; SEMICONDUCTOR DEVICE ASSEMBLY; AND RECTIFIER NETWORK, UNITIZED.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
SKD160/12 | 58687 | A | 3 | 2 | 4 | ZZ |
CAGE Information
Code | Company |
---|---|
58687 | SEMIKRON INTL INC |
Federal Supply Class
Title
SEMICONDUCTOR DEVICES AND ASSOCI
Inclusions:
INCLUDES SEMICONDUCTOR ASSEMBLIES; SEMICONDUCTOR DIODES; SEMICONDUCTOR RECTIFIERS, SEMICONDUCTOR THYRISTORS; TRANSISTORS; UNITIZED SEMICONDUCTORS; ASSOCIATED HARDWARE EXCEPT SOCKETS.
Exclusions:
EXCLUDES MICROCIRCUITS; OPTOELECTRONIC DEVICES AND ASSOCIATED HARDWARE.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
AXGY | MOUNTING METHOD | UNTHREADED HOLE AND SLOT |
AGAV | END ITEM IDENTIFICATION | VARIOUS |
FEAT | SPECIAL FEATURES | PLASTIC CASE W/ SCREW TERMINALS, ISOLATED BASE PLATE, BLOCKING VOLTAGE UP TO 1800 V, HIGH SURGE CURRENTS, THREE PHASE BRIDGE RECTIFIER 160 A |
ABMK | OVERALL WIDTH | 54.0 MILLIMETERS NOMINAL |
ABKW | OVERALL HEIGHT | 30.0 MILLIMETERS NOMINAL |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | POWER BRIDGE RECTIFIER |
ABHP | OVERALL LENGTH | 94.0 MILLIMETERS NOMINAL |