NIIN Output Data
NIIN:
NSN:
Item Name:
BACKPLANE ASSEMBLY
Definition:
AN INSULATING PANEL UPON WHICH TWO OR MORE CONNECTOR, RECEPTACLE, ELECTRICAL, ARE MOUNTED, AND COMPLETELY PROCESSED ELECTRICAL CONDUCTOR PATHS ARE DEPOSITED, ETCHED, OR PRINTED IN VARIOUS PATHS. IT PROVIDES OR COMPLETES A CIRCUIT BETWEEN TWO OR MORE CIRCUIT CARD ASSEMBLY OR ELECTRONIC COMPONENTS ASSEMBLY. IT MAY BE DESIGNED FOR PANEL OR CHASSIS MOUNTING, OR FOR INSERTION INTO A CONNECTOR, RECEPTACLE, ELECTRICAL. INCLUDES MOTHERBOARDS. FOR ITEMS CONTAINING PROCESSED ELECTRICAL CONDUCTOR PATHS AND CONTACTS FOR PLUG-IN CONNECTING FACILITIES, SEE PRINTED WIRING BOARD. SEE ALSO PRINTED CIRCUIT BOARD; CIRCUIT CARD ASSEMBLY AND CABLE ASSEMBLY, PRINTED, FLEXIBLE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| IB820H-R | 0XU54 | A | 5 | 2 | 3 | 9Z | ||
| SBC-IB820H-R | 0XU54 | A | 3 | 2 | 3 | 9Z |
CAGE Information
| Code | Company |
|---|---|
| 0XU54 | TECHNOLAND INC DBA IBASE TECHNOLOGY |
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| ABHP | OVERALL LENGTH | 338.0 MILLIMETERS NOMINAL |
| FEAT | SPECIAL FEATURES | SOCKET 475 845GV W/VGA AND ROHS COMPLIANT ETHERNET; DDR DIMM X 2, MAX 2GB; PENTIUM 4 2.2GHZ W/512MB DDR; 0-60 DEG C OPERATING TEMPERATURE |
| ABMK | OVERALL WIDTH | 122.0 MILLIMETERS NOMINAL |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | CPU CARD |
| FTLD | FUNCTIONAL DESCRIPTION | FULL SIZE CPU CARD W/INTEL 845GV CHIPSET |