Part Number
Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , HYBRID
Definition:
A CIRCUIT IN WHICH ONE TYPE OF MICROCIRCUIT IS COMBINED WITH SOME OTHER TYPE OF MICROCIRCUIT OR WITH DISCRETE COMPONENTS. FOR TWO MICROCIRCUITS ON A COMMON MOUNTING OR ON EACH OTHER, SEE MICROCIRCUIT ASSEMBLY. FOR MICROCIRCUITS HAVING A COMPLETE INDEPENDENT MEMORY FUNCTION, SEE MICROCIRCUIT (1), MEMORY.
CAGE Information
Code | Company |
---|---|
12436 | BAE SYSTEMS NATIONAL SECURITY SOLUTI |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
TTQY | TERMINAL TYPE AND QUANTITY | 18 PIN |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CQSZ | INCLOSURE CONFIGURATION | PIN GRID ARRAY |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |