Part Number
Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , HYBRID
Definition:
A CIRCUIT IN WHICH ONE TYPE OF MICROCIRCUIT IS COMBINED WITH SOME OTHER TYPE OF MICROCIRCUIT OR WITH DISCRETE COMPONENTS. FOR TWO MICROCIRCUITS ON A COMMON MOUNTING OR ON EACH OTHER, SEE MICROCIRCUIT ASSEMBLY. FOR MICROCIRCUITS HAVING A COMPLETE INDEPENDENT MEMORY FUNCTION, SEE MICROCIRCUIT (1), MEMORY.
CAGE Information
| Code | Company |
|---|---|
| 10001 | NAVAIR AND NAVSEA MANAGED ORIGINAL D |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 780.0 MILLIWATTS |
| CBBL | FEATURES PROVIDED | UNIPOLAR AND LASER TRIMMED AND LOW IMPEDANCE AND BIPOLAR AND HERMETICALLY SEALED AND HIGH SPEED AND HYBRID AND HIGH PERFORMANCE AND BURN IN, MIL-STD-883, CLASS B |
| ADAQ | BODY LENGTH | 1.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.168 INCHES MAXIMUM |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 CONVERTER, DIGITAL TO ANALOG |
| ADAT | BODY WIDTH | 0.800 INCHES MAXIMUM |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 15.0 VOLTS NOMINAL POWER SOURCE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CRHL | BIT QUANTITY (NON-CORE) | 10 |
| CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM SETTLING |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 15.00 OUTPUT PICOFARADS NOMINAL |
| CZES | HYBRID TECHNOLOGY TYPE | FILM AND MULTICHIP |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |