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Part Number

Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , HYBRID

Definition:

A CIRCUIT IN WHICH ONE TYPE OF MICROCIRCUIT IS COMBINED WITH SOME OTHER TYPE OF MICROCIRCUIT OR WITH DISCRETE COMPONENTS. FOR TWO MICROCIRCUITS ON A COMMON MOUNTING OR ON EACH OTHER, SEE MICROCIRCUIT ASSEMBLY. FOR MICROCIRCUITS HAVING A COMPLETE INDEPENDENT MEMORY FUNCTION, SEE MICROCIRCUIT (1), MEMORY.

CAGE Information

Code Company
15090 RAYTHEON COMPANY DBA RAYTHEON DIV MI

Federal Supply Class

Title

MICROCIRCUITS, ELECTRONIC

Inclusions:

INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.

Exclusions:

EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.

Characteristics (Decoded)

MRC Requirements Statement Clear Text Reply
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 50.0 VOLTS MAXIMUM POWER SOURCE
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
CSSL DESIGN FUNCTION AND QUANTITY 2 OSCILLATOR
FEAT SPECIAL FEATURES SOLID STATE;AUTOMATIC CONTROL METHOD;REMOTE CONTROL TYPE;TOP AND BOTTOMWIRE LEAD TERMINALS;15 EXTERNAL WIRE LEAD TERMINALS;ENCASED;1.148 IN.LG; 0.275 IN.H;0.960 IN.W
CQSJ INCLOSURE MATERIAL CERAMIC
CQSZ INCLOSURE CONFIGURATION LEADED CHIP CARRIER
CBBL FEATURES PROVIDED BURN IN AND ELECTROSTATIC SENSITIVE
CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
CZES HYBRID TECHNOLOGY TYPE MONOLITHIC
TTQY TERMINAL TYPE AND QUANTITY 30 PRINTED CIRCUIT
CWSG TERMINAL SURFACE TREATMENT SOLDER

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