Part Number
Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , HYBRID
Definition:
A CIRCUIT IN WHICH ONE TYPE OF MICROCIRCUIT IS COMBINED WITH SOME OTHER TYPE OF MICROCIRCUIT OR WITH DISCRETE COMPONENTS. FOR TWO MICROCIRCUITS ON A COMMON MOUNTING OR ON EACH OTHER, SEE MICROCIRCUIT ASSEMBLY. FOR MICROCIRCUITS HAVING A COMPLETE INDEPENDENT MEMORY FUNCTION, SEE MICROCIRCUIT (1), MEMORY.
CAGE Information
Code | Company |
---|---|
15090 | RAYTHEON COMPANY DBA RAYTHEON DIV MI |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 50.0 VOLTS MAXIMUM POWER SOURCE |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CSSL | DESIGN FUNCTION AND QUANTITY | 2 OSCILLATOR |
FEAT | SPECIAL FEATURES | SOLID STATE;AUTOMATIC CONTROL METHOD;REMOTE CONTROL TYPE;TOP AND BOTTOMWIRE LEAD TERMINALS;15 EXTERNAL WIRE LEAD TERMINALS;ENCASED;1.148 IN.LG; 0.275 IN.H;0.960 IN.W |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZES | HYBRID TECHNOLOGY TYPE | MONOLITHIC |
TTQY | TERMINAL TYPE AND QUANTITY | 30 PRINTED CIRCUIT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |