National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
TRANSISTOR
Definition:
AN ACTIVE SEMICONDUCTOR DEVICE WITH THREE OR MORE ELECTRODES. MAY OR MAY NOT INCLUDE MOUNTING HARDWARE AND/OR HEATSINK. EXCLUDES SEMICONDUCTOR DEVICE, DIODE AND SEMICONDUCTOR DEVICE, THYRISTOR. FOR SOLID STATE DEVICES WHICH ARE RESPONSIVE TO VISIBLE OR INFRARED RADIANT ENERGY, SEE SEMICONDUCTOR DEVICE, PHOTO.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
IRFIBC30G | 59993 | C | 3 | 2 | 2 | 9Z |
CAGE Information
Code | Company |
---|---|
59993 | INTERNATIONAL RECTIFIER CORPORATION |
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
CTQX | CURRENT RATING PER CHARACTERISTIC | 2.50 AMPERES SOURCE CUTOFF CURRENT MAXIMUM OF STANDARD RANGE AND 1.60 AMPERES SERVICE VOLTAGE MAXIMUM OF STANDARD RANGE |
ABKW | OVERALL HEIGHT | 0.180 INCHES MINIMUM AND 0.190 INCHES MAXIMUM |
FEAT | SPECIAL FEATURES | ISOLATED PACKAGE; HIGH VOLTAGE ISOLATION=2.5 KVRMS; SINK TO LEAD CREEPAGE DIST=4.8MM; DYNAMIC DV/DT RATING; LOW THERMAL RESISTANCE; LEAD FREE; THE TO-220 FULLPAK ELIMINATES THE NEED FOR ADDITIONAL INSULATING HARDWARE IN COMMERCIAL-INDUSTRIAL APPLICATIONS; THE MOULDING COMPOUND USED PROVIDES A HIGH ISOLATION CAPABILITY AND A LOW THEMAL RESISTANCE BETWEEN THE TAP AND EXTERNA HEATSINK; THIS ISOLATION IS EQUIVALENT TO USING A 100 MICRON MICA BARRIER WITH STANDARD TO-220 PRODUCT THE FULLPAK IS MOUNTED TO A HEATSINK USING A SINGLE CLIP OR BY A SINGLE SCREW FIXING |
ABHP | OVERALL LENGTH | 1.142 INCHES MINIMUM AND 1.176 INCHES MAXIMUM |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | TO-220 FULLPAK |
ABMK | OVERALL WIDTH | 0.408 INCHES MINIMUM AND 0.419 INCHES MAXIMUM |
AXGY | MOUNTING METHOD | CLIP |