National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| SCM702F | 04713 | A | 5 | 2 | 5 | TX | ||
| 320H110 | 93332 | H | C | 1 | 6 | ZZ | AC | |
| CF613 | 18324 | A | 5 | 2 | 5 | TX | ||
| ROM/PROM FAMILY 004 | 16236 | A | 5 | 1 | 5 | TX | ||
| HR0M8256G0575 | 34371 | A | 5 | 9 | 5 | TX | ||
| 717383-110 | 05869 | A | 3 | 2 | 1 | TX |
CAGE Information
| Code | Company |
|---|---|
| 04713 | FREESCALE SEMICONDUCTOR INC. |
| 93332 | SYLVANIA ELECTRIC PRODUCTS INC SEMIC |
| 18324 | PHILIPS SEMICONDUCTORS INC |
| 16236 | DLA LAND AND MARITIME |
| 34371 | INTERSIL CORPORATION |
| 05869 | RAYTHEON COMPANY DBA RAYTHEON |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| TEST | TEST DATA DOCUMENT | 05869-717383 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| TEST | TEST DATA DOCUMENT | 05869-717383 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 625.0 MILLIWATTS |
| CSWJ | WORD QUANTITY (NON-CORE) | 32 |
| AGAV | END ITEM IDENTIFICATION | 58404091248 |
| CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.075 INCHES MAXIMUM |
| CRHL | BIT QUANTITY (NON-CORE) | 256 |
| CBBL | FEATURES PROVIDED | POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND NEGATIVE OUTPUTS AND MONOLITHIC AND HERMETICALLY SEALED AND PROGRAMMED AND EXPANDABLE AND W/DECODED OUTPUT AND W/BUFFERED OUTPUT AND BIPOLAR AND WIRE-OR OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| AFGA | OPERATING TEMP RANGE | +0.0/+75.0 DEG CELSIUS |
| ADAQ | BODY LENGTH | 0.340 INCHES MINIMUM AND 0.440 INCHES MAXIMUM |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
| ADAT | BODY WIDTH | 0.265 INCHES MINIMUM AND 0.325 INCHES MAXIMUM |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
Similar Parts
SCM702F ,
SCM702F ,
5962-00-179-2903 ,
5962001792903 ,
001792903
,
SCM702F ,
320H110 ,
CF613 ,
ROM/PROM FAMILY 004 ,
HR0M8256G0575 ,
717383-110 ,