National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , DIGITAL
Definition:
A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| F51CJ2 | 49956 | A | C | 1 | 9 | TU | ||
| F51K2 | 3B150 | A | 5 | 2 | 5 | TX | ||
| 351-7107-022 | 13499 | A | 3 | 2 | 1 | TX | ||
| F51K2 | 49956 | A | 5 | 9 | 5 | TX | ||
| RF51K2 | 3B150 | A | 5 | 2 | 5 | TX | ||
| SC2547FH22A | 04713 | A | 5 | 9 | 5 | TX | ||
| RF51K2 | 49956 | A | 5 | 9 | 5 | TX |
CAGE Information
| Code | Company |
|---|---|
| 04713 | FREESCALE SEMICONDUCTOR INC. |
| 49956 | RAYTHEON COMPANY DBA RAYTHEON |
| 3B150 | RAYTHEON TECHNICAL SERVICES COMPANY |
| 13499 | ROCKWELL COLLINS INC. DBA GOVERNMENT |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | PRESETTABLE AND RESETTABLE AND NEGATIVE EDGE TRIGGERED AND POSITIVE OUTPUTS AND MEDIUM POWER AND MEDIUM SPEED AND HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TEST | TEST DATA DOCUMENT | 13499-351-7107 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| AFJQ | STORAGE TEMP RANGE | -65.0/+200.0 DEG CELSIUS |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-85 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 80.0 MILLIWATTS |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINALS GOLD |
| ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| ADAQ | BODY LENGTH | 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 COUNTER, BINARY CODED DECIMAL TO BINARY AND 1 FLIP-FLOP, J-K/R-S, CLOCKED |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| ADAT | BODY WIDTH | 0.160 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
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,
F51CJ2 ,
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