National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
ROM/PROM HEAD 018 | 14933 | R | 5 | 1 | 5 | TX | ||
5962-3820101BJB | 81349 | M | 5 | 2 | E | 9Z | ||
M38510/20101BJB | 81349 | M | 2 | 2 | 3 | TX | ||
MIL-M-38510/201 | 81349 | M | 4 | 1 | 3 | TX | ||
DMS 84099B | 14933 | R | 5 | 1 | 9 | TX | ||
5962-3820101BJX | 81349 | M | 5 | 9 | E | TX | ||
JAN-0512 | 34371 | A | 5 | 9 | 4 | 9Z |
CAGE Information
Code | Company |
---|---|
14933 | DEFENSE ELECTRONICS SUPPLY CENTER |
81349 | MILITARY SPECIFICATIONS PROMULGATED |
34371 | INTERSIL CORPORATION |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL |
CSWJ | WORD QUANTITY (NON-CORE) | 64 |
AEHX | MAXIMUM POWER DISSIPATION RATING | 575.0 MILLIWATTS |
ADAU | BODY HEIGHT | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
CRHL | BIT QUANTITY (NON-CORE) | 512 |
ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND W/OPEN COLLECTOR AND POSITIVE OUTPUTS AND W/DECODED OUTPUT |
ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/201 GOVERNMENT SPECIFICATION |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CZZZ | MEMORY CAPACITY | UNKNOWN |
CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |