National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , DIGITAL
Definition:
A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 717381-5 | 05869 | A | 3 | 2 | 5 | TX | ||
| 1900009-100 | 05869 | A | 5 | 2 | 5 | TX |
CAGE Information
| Code | Company |
|---|---|
| 05869 | RAYTHEON COMPANY DBA RAYTHEON |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR AND 1 ARRAY, LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 23 INPUT |
| ADAU | BODY HEIGHT | 0.080 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.9 WATTS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| AFGA | OPERATING TEMP RANGE | -0.0/+70.0 DEG CELSIUS |
| ADAQ | BODY LENGTH | 1.050 INCHES MINIMUM AND 1.070 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 18.0 VOLTS MAXIMUM POWER SOURCE |
| ADAT | BODY WIDTH | 0.635 INCHES MINIMUM AND 0.645 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | W/RESET AND 2-STATE OUTPUT AND ELECTROSTATIC SENSITIVE AND PARALLEL OPERATION AND W/CLOCK AND W/HEAT SINK |
| TEST | TEST DATA DOCUMENT | 05869-717381 DRAWING |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 FLAT LEADS |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND METAL |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |