National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 932883-11 | 82577 | A | 3 | 2 | 1 | TX | ||
| HR10709 | 07263 | A | 5 | 9 | 6 | TX | ||
| DH75699 | 34335 | A | 5 | 9 | 6 | TX | ||
| HM7643 | 34371 | A | 5 | 9 | 6 | TX | ||
| B2052-11 | 34371 | A | C | 1 | 5 | TX | AF | |
| HM9-7643-B2052-11 | 34371 | A | 5 | 9 | 5 | TX | ||
| SD948 | 50364 | F | 5 | 1 | 6 | TX | ||
| 93453 | 07263 | A | 5 | 1 | 6 | TX | ||
| 5353-1F | 50364 | F | 5 | 1 | 6 | TX | ||
| 53S441-F | 50364 | F | 5 | 1 | 6 | TX | ||
| B1614-1B | 34371 | A | 5 | 1 | 6 | TX | ||
| 17994 | 50364 | F | 5 | 9 | 5 | TX | ||
| ROM/PROM FAMILY 017 | 16236 | A | 5 | 1 | 5 | TX | ||
| HL42543 | 07263 | A | 5 | 1 | 6 | TX | ||
| 27S33 | 34335 | A | 5 | 9 | 6 | TX | ||
| MM5353 | 50364 | F | 5 | 1 | 6 | TX |
CAGE Information
| Code | Company |
|---|---|
| 07263 | FAIRCHILD SEMICONDUCTOR CORP |
| 82577 | RAYTHEON COMPANY DBA RAYTHEON |
| 34335 | ADVANCED MICRO DEVICES, INC. DBA A M |
| 34371 | INTERSIL CORPORATION |
| 50364 | MMI/AMD |
| 16236 | DLA LAND AND MARITIME |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
| CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 175.0 MILLIWATTS |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 FLAT LEADS |
| CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| ADAQ | BODY LENGTH | 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
| CRHL | BIT QUANTITY (NON-CORE) | 4096 |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| ADAT | BODY WIDTH | 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.090 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND W/BUFFERED OUTPUT AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BIPOLAR AND BURN IN, MIL-STD-883, CLASS B AND 3-STATE OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CSWJ | WORD QUANTITY (NON-CORE) | 1024 |
| TEST | TEST DATA DOCUMENT | 82577-932883 DRAWING |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |