National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
DMPAL12L6J/883 | 27014 | A | 5 | 9 | E | TX | ||
5962-3850307BRA | 81349 | M | 5 | 1 | E | TX | ||
ROM/PROM HEAD 103 | 16236 | A | 5 | 1 | 9 | ZZ | ||
6405548-1 | 55974 | A | C | 1 | 5 | TX | AF | |
PAL12L6 | 34335 | A | C | 1 | 5 | ZZ | AC | |
7909914-12 | 90536 | A | C | 1 | 5 | TX | AF | |
M38510/50307BRB | 81349 | M | 5 | 9 | E | TX | ||
M38510/50307BRA | 81349 | M | 2 | 2 | E | TX | ||
351-3656-092 | 13499 | A | C | 1 | 5 | TX | AF | |
5962-3850307BRB | 81349 | M | 5 | 9 | E | TX | ||
5962-3850307BRX | 81349 | M | 5 | 9 | E | TX | ||
PAL12L6 | 50364 | F | 5 | 9 | E | TX | ||
MIL-M-38510/503 | 81349 | M | 4 | 1 | E | TX |
CAGE Information
Code | Company |
---|---|
13499 | ROCKWELL COLLINS INC. DBA GOVERNMENT |
27014 | NATIONAL SEMICONDUCTOR CORPORATION |
81349 | MILITARY SPECIFICATIONS PROMULGATED |
16236 | DLA LAND AND MARITIME |
55974 | HONEYWELL INTL INC DEFENSE AVIONICS |
34335 | ADVANCED MICRO DEVICES, INC. DBA A M |
90536 | LOCKHEED MARTIN CORPORATION DBA LOCK |
50364 | MMI/AMD |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION |
ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/503 GOVERNMENT SPECIFICATION |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR |
CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
ADAU | BODY HEIGHT | 0.185 INCHES NOMINAL |
TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
AEHX | MAXIMUM POWER DISSIPATION RATING | 2.0 WATTS |
CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES REVERSE CURRENT, DC NOMINAL |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
CZER | MEMORY DEVICE TYPE | PAL |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |