National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| HE3108-0-D | 55267 | A | 5 | 9 | 5 | TX | ||
| HE3108-0-D-001 | 55267 | A | 5 | 9 | E | TX | ||
| HC3108 | 55267 | A | 5 | 1 | 6 | TX | ||
| HE3108-0-D-005 | 55267 | A | 5 | 2 | 6 | TX | ||
| 477-2060-001 | 94756 | A | 3 | 2 | A | TX | ||
| ROM/PROM | 16236 | A | 5 | 1 | 9 | TX |
CAGE Information
| Code | Company |
|---|---|
| 16236 | DLA LAND AND MARITIME |
| 55267 | RAYTHEON COMPANY DBA RAYTHEON |
| 94756 | BOEING COMPANY, THE DIV DEFENSE, SPA |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| ADAQ | BODY LENGTH | 1.260 INCHES MAXIMUM |
| CRHL | BIT QUANTITY (NON-CORE) | 8192 |
| ADAU | BODY HEIGHT | 0.165 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.600 INCHES MAXIMUM |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 18.0 VOLTS MAXIMUM POWER SOURCE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND ERASABLE AND PROGRAMMABLE AND W/ENABLE |
| CZER | MEMORY DEVICE TYPE | ROM |
| CSWJ | WORD QUANTITY (NON-CORE) | 1024 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
Similar Parts
ROM/PROM ,
ROMPROM ,
5962-01-238-2671 ,
5962012382671 ,
012382671
,
HE3108-0-D ,
HE3108-0-D-001 ,
HC3108 ,
HE3108-0-D-005 ,
477-2060-001 ,
ROM/PROM ,