National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , DIGITAL
Definition:
A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 31301037GP2 | 58307 | A | 5 | 9 | 5 | TX | ||
| 31301037GO2 | 58307 | A | 3 | 1 | A | TX | ||
| L04081 | 16236 | A | 3 | 2 | A | TX | ||
| MC14011BBCBS | 04713 | A | 3 | 1 | E | TX | ||
| CD4011BF/3 | 18714 | A | 3 | 1 | E | TX | ||
| CD4011BMJ/883 | 27014 | A | 3 | 1 | E | TX |
CAGE Information
| Code | Company |
|---|---|
| 04713 | FREESCALE SEMICONDUCTOR INC. |
| 58307 | GENERAL ATOMICS ELECTRONIC SYSTEMS I |
| 16236 | DLA LAND AND MARITIME |
| 18714 | HARRIS CORP FINDLAY OPNS |
| 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-1 MIL-M-38510 |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AGAV | END ITEM IDENTIFICATION | NUCLEAR POWER PLANTS |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| ADAQ | BODY LENGTH | 0.785 INCHES MAXIMUM |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| FEAT | SPECIAL FEATURES | ITEM MUST COMPLY WITH REQUIREMENTS OF DEFENSE ELECTRONICS SUPPLY CENTER PRODUCTION STANDARD NO. L04081; FOR NAVY NUCLEAR PROPULSION PLANT PRODUCTS ONLY |
| CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND BURN IN AND HERMETICALLY SEALED AND POSITIVE OUTPUTS |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CRTL | CRITICALITY CODE JUSTIFICATION | FEAT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 18.0 VOLTS MAXIMUM POWER SOURCE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CSSL | DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND |
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,
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