National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 3221300-25 | 10001 | A | 3 | 2 | A | TX | ||
| 717393-26 | 05869 | A | 5 | 2 | 5 | TX | ||
| ROM/PROM FAMILY 022 | 16236 | A | 5 | 1 | 6 | TX | ||
| 82S23/BFA | 18324 | A | 5 | 1 | E | TX | ||
| 5330-1F883C | 50364 | F | 5 | 1 | 5 | TX |
CAGE Information
| Code | Company |
|---|---|
| 05869 | RAYTHEON COMPANY DBA RAYTHEON |
| 10001 | NAVAIR AND NAVSEA MANAGED ORIGINAL D |
| 16236 | DLA LAND AND MARITIME |
| 18324 | PHILIPS SEMICONDUCTORS INC |
| 50364 | MMI/AMD |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CSWJ | WORD QUANTITY (NON-CORE) | 32 |
| CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAT | BODY WIDTH | 0.285 INCHES MAXIMUM |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | W/OPEN COLLECTOR AND BIPOLAR AND MONOLITHIC AND PROGRAMMABLE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-5 MIL-M-38510 |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 332.8 MILLIWATTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CRHL | BIT QUANTITY (NON-CORE) | 256 |
| ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
Similar Parts
717393-26 ,
71739326 ,
5962-01-310-8695 ,
5962013108695 ,
013108695
,
3221300-25 ,
717393-26 ,
ROM/PROM FAMILY 022 ,
82S23/BFA ,
5330-1F883C ,