National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| EP310DM883B | 67183 | A | 5 | 1 | 6 | TX | ||
| 5962-8863501RB | 67268 | A | 5 | 9 | E | TX | ||
| 5962-8863501RX | 67268 | A | 5 | 9 | E | TX | ||
| 5962-8863501RA | 67268 | A | 2 | 2 | E | TX | ||
| ROM/PROM HEAD 175 | 14933 | R | 5 | 1 | 6 | TX | ||
| 5962-88635 | 67268 | A | 4 | 1 | E | TX |
CAGE Information
| Code | Company |
|---|---|
| 14933 | DEFENSE ELECTRONICS SUPPLY CENTER |
| 67183 | ALTERA CORPORATION |
| 67268 | DLA LAND AND MARITIME OPNS SUPPORT G |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 40.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| ADAU | BODY HEIGHT | 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND POSITIVE OUTPUTS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 12.00 INPUT PASCAL DENSE STRUCTURAL 65 AND 12.00 OUTPUT PASCAL DENSE STRUCTURAL 65 |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CZER | MEMORY DEVICE TYPE | PROGRAMMABLE |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | 300 GATE ERASABLE PROGRAMMABLE LOGIC DEVICE |
| ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM ACCESS |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
| CQZP | INPUT CIRCUIT PATTERN | 18 INPUT |
| PKWT | UNPACKAGED UNIT WEIGHT | 2.4 GRAMS |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.400 INCHES MAXIMUM |
| ABHP | OVERALL LENGTH | 1.060 INCHES MAXIMUM |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 320.0 MILLIWATTS |