National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
6166741 | 53711 | A | 3 | 2 | A | TX | ||
6166741 | 13675 | A | 5 | 1 | 5 | ZZ | ||
78022-01JC | 16236 | A | C | 1 | 6 | ZZ | AC | |
6166741 | 59475 | A | 5 | 1 | 5 | ZZ | ||
6166783-002 | 35351 | A | 5 | 1 | A | TX | ||
ROM/PROM | 16236 | A | 5 | 1 | 9 | ZZ | ||
6166741 | 15090 | A | 5 | 2 | 5 | TX |
CAGE Information
Code | Company |
---|---|
13675 | WEMS INC. DBA WEMS ELECTRONICS DIV W |
53711 | NAVAL SEA SYSTEMS COMMAND |
16236 | DLA LAND AND MARITIME |
59475 | REX SYSTEMS INCORPORATED |
35351 | GE AVIATION SYSTEMS LLC |
15090 | RAYTHEON COMPANY DBA RAYTHEON DIV MI |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
CBBL | FEATURES PROVIDED | BURN IN AND MONOLITHIC AND HERMETICALLY SEALED AND PROGRAMMED |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
AEHX | MAXIMUM POWER DISSIPATION RATING | 635.0 MILLIWATTS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CRHL | BIT QUANTITY (NON-CORE) | 16384 |
CZEQ | TIME RATING PER CHACTERISTIC | 450.00 NANOSECONDS MAXIMUM DELAY |
CZER | MEMORY DEVICE TYPE | PROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
CSWJ | WORD QUANTITY (NON-CORE) | 2048 |
ADAT | BODY WIDTH | 0.610 INCHES MAXIMUM |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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