National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , DIGITAL
Definition:
A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| A2N 20240626 | U2982 | A | 5 | 2 | 4 | ZK | ||
| PT2568-4-906668 | U2982 | A | 5 | 2 | 4 | ZK | ||
| SNJ54BCT8244AFK | 01295 | A | 5 | 1 | 4 | 9Z | ||
| 5962-9172601M3A | 67268 | A | 2 | 2 | E | 9Z | ||
| 5962-91726 | 67268 | A | 4 | 1 | E | 9Z | ||
| 446/4/80395/244 | U2982 | A | 5 | 2 | 4 | ZK |
CAGE Information
| Code | Company |
|---|---|
| 01295 | TEXAS INSTRUMENTS INCORPORATED DBA T |
| U2982 | BAE SYSTEMS DEFENCE SYSTEMS LTD |
| 67268 | DLA LAND AND MARITIME OPNS SUPPORT G |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 497.0 MILLIWATTS |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 BUFFER |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | TESTED TO MIL-STD-883 |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | SCAN TEST DEVICE W/ OCTAL BUFFER |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |