National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 5962-8984102KA | 67268 | A | 2 | 2 | E | ZZ | ||
| PALC22V10D-20KMB | 65786 | A | 5 | 1 | 5 | ZZ | ||
| PALCE22V10-20KMB | 65786 | A | 5 | 1 | 5 | ZZ | ||
| 5962-8984102KB | 67268 | A | 5 | 9 | E | ZZ | ||
| 5962-8984102KX | 67268 | A | 5 | 9 | E | ZZ | ||
| ROM/PROM HEAD 273 | 16236 | A | 5 | 1 | 9 | ZZ | ||
| 5962-89841 | 67268 | A | 4 | 1 | E | ZZ |
CAGE Information
| Code | Company |
|---|---|
| 16236 | DLA LAND AND MARITIME |
| 67268 | DLA LAND AND MARITIME OPNS SUPPORT G |
| 65786 | CYPRESS SEMICONDUCTOR CORPORATION |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT |
| CBBL | FEATURES PROVIDED | HIGH RELIABILITY AND LOW POWER AND PROGRAMMABLE AND ERASABLE AND MONOLITHIC |
| CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS AF OUTPUT MEGAWATTS |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, PROGRAMMABLE ARRAY LOGIC (EEPLD), MONOLITHIC SILICON |
| FEAT | SPECIAL FEATURES | GENERIC P/N 22V10/22-INPUT, 10 OUYPUT, EECMOS, ARCHITECTURALLY GENERIC, PROGRAMMABLE AND-OR ARRAY |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 BONDING PAD |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS |
| CQSJ | INCLOSURE MATERIAL | GLASS AND CERAMIC |