National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , DIGITAL
Definition:
A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 351-7341-012 | 13499 | A | 3 | 9 | 1 | TX | ||
| 351-7341-012 | 49956 | A | 5 | 9 | 5 | TX | ||
| SM20-14 | 93332 | H | 5 | 9 | 5 | TX | ||
| RX5987 | 49956 | A | 5 | 9 | 5 | TX | ||
| RL20K | 49956 | A | 5 | 9 | 3 | TX | ||
| RX5987 | 3B150 | A | 5 | 2 | 5 | TX | ||
| RL20K | 3B150 | A | 5 | 1 | 3 | TX |
CAGE Information
| Code | Company |
|---|---|
| 13499 | ROCKWELL COLLINS INC. DBA GOVERNMENT |
| 49956 | RAYTHEON COMPANY DBA RAYTHEON |
| 93332 | SYLVANIA ELECTRIC PRODUCTS INC SEMIC |
| 3B150 | RAYTHEON TECHNICAL SERVICES COMPANY |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CQZP | INPUT CIRCUIT PATTERN | 9 INPUT |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND POSITIVE OUTPUTS AND HIGH SPEED AND FAST CARRY AND EXPANDABLE AND MONOLITHIC AND W/DECODED OUTPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 ADDER, FAST, DEPENDENT CARRY |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 125.0 MILLIWATTS |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| TEST | TEST DATA DOCUMENT | 13499-351-7341 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CRHL | BIT QUANTITY (NON-CORE) | 16 |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| ADAQ | BODY LENGTH | 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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