National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , DIGITAL
Definition:
A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| M38510/00403BAX | 81349 | M | 5 | 9 | 3 | ZZ | ||
| M38510/00403BAA | 81349 | M | 2 | 2 | 3 | ZZ | ||
| GEM05801BAA | 0DKS7 | A | 5 | 1 | 5 | ZZ | ||
| MIL-M-38510/4 | 81349 | M | 4 | 1 | 3 | TX | ||
| DMS83034B | 16236 | A | 5 | 9 | 5 | TX | ||
| RB8815W | 18324 | A | C | 1 | 3 | ZZ | AC | |
| M38510/00403BAB | 81349 | M | 5 | 9 | 3 | TX |
CAGE Information
| Code | Company |
|---|---|
| 0DKS7 | SRI INTERNATIONAL |
| 81349 | MILITARY SPECIFICATIONS PROMULGATED |
| 16236 | DLA LAND AND MARITIME |
| 18324 | PHILIPS SEMICONDUCTORS INC |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CQZP | INPUT CIRCUIT PATTERN | DUAL 5 INPUT |
| TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL |
| CBBL | FEATURES PROVIDED | W/TOTEM POLE OUTPUT AND POSITIVE OUTPUTS AND MONOLITHIC AND HERMETICALLY SEALED AND W/STROBE |
| CSSL | DESIGN FUNCTION AND QUANTITY | 2 GATE, NOR |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.280 INCHES MAXIMUM |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-1 MIL-M-38510 |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/4 GOVERNMENT SPECIFICATION |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 120.0 MILLIWATTS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 3.00 NANOSECONDS MINIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 27.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 3.00 NANOSECONDS MINIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 24.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |