National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| B77T0189-0123 | 12464 | R | 3 | 9 | 1 | TX | ||
| ROM/PROM HEAD 024 | 16236 | A | 5 | 9 | 5 | TX | ||
| MM4203Q | 27014 | A | 5 | 2 | 5 | TX | ||
| DMS 81091B | 16236 | A | 5 | 9 | 9 | TX | ||
| MM42030 | 27014 | A | C | 1 | 6 | ZZ | AC | |
| ROM/PROM | 16236 | A | 5 | 1 | 9 | ZZ |
CAGE Information
| Code | Company |
|---|---|
| 12464 | MCDONNELL DOUGLAS CORP MCDONNELL DOU |
| 16236 | DLA LAND AND MARITIME |
| 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CZEQ | TIME RATING PER CHACTERISTIC | 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
| AFJQ | STORAGE TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CBBL | FEATURES PROVIDED | NEGATIVE OUTPUTS AND HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND BIPOLAR AND W/STORAGE AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND HIGH SPEED |
| ADAU | BODY HEIGHT | 0.120 INCHES MINIMUM AND 0.250 INCHES MAXIMUM |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-015-AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| AFGA | OPERATING TEMP RANGE | -55.0/+85.0 DEG CELSIUS |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CZER | MEMORY DEVICE TYPE | ROM |
| ADAQ | BODY LENGTH | 1.200 INCHES MINIMUM AND 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.515 INCHES MINIMUM AND 0.580 INCHES MAXIMUM |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -20.0 VOLTS MINIMUM POWER SOURCE AND 0.3 VOLTS MAXIMUM POWER SOURCE |
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