National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , DIGITAL
Definition:
A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| SL3742 | 07263 | A | 5 | 2 | 5 | TX | ||
| 932HC | 07263 | A | 3 | 9 | 3 | TX | ||
| RC932T | 3B150 | A | 5 | 2 | 5 | TX | ||
| RC932T | 49956 | A | 5 | 9 | 5 | TX | ||
| 51007230 | 15920 | H | 5 | 9 | 1 | TX | ||
| SC1552GK | 04713 | A | 5 | 2 | 5 | TX |
CAGE Information
| Code | Company |
|---|---|
| 04713 | FREESCALE SEMICONDUCTOR INC. |
| 07263 | FAIRCHILD SEMICONDUCTOR CORP |
| 3B150 | RAYTHEON TECHNICAL SERVICES COMPANY |
| 49956 | RAYTHEON COMPANY DBA RAYTHEON |
| 15920 | CONTROL DATA CORP ROSEVILLE OPNS TER |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACE GOLD |
| CQWX | OUTPUT LOGIC FORM | DIODE-TRANSISTOR LOGIC |
| CSSL | DESIGN FUNCTION AND QUANTITY | 2 GATE, NAND-OR BUFFER |
| PRMT | PRECIOUS MATERIAL | GOLD |
| CBBL | FEATURES PROVIDED | EXPANDABLE AND MEDIUM SPEED AND MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
| CQZP | INPUT CIRCUIT PATTERN | DUAL 3 INPUT |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFGA | OPERATING TEMP RANGE | +0.0/+75.0 DEG CELSIUS |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-100 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| ADAR | BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| TEST | TEST DATA DOCUMENT | 15920-51007230 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 150.0 MILLIWATTS |