National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 932085-554B | 82577 | A | 3 | 2 | 1 | TX | ||
| SCM780FH-14 | 04713 | A | 5 | 2 | 5 | TX | ||
| HPROM9-0512-554B-G0779 | 34371 | A | 5 | 9 | 5 | TX | ||
| ROM/PROM FAMILY 001 | 16236 | A | 5 | 1 | 5 | TX | ||
| HPROM9-0512-G0779 | 34371 | A | 5 | 9 | 5 | TX | ||
| HPROM9+0512G0779 | 34371 | A | C | 1 | 9 | TU |
CAGE Information
| Code | Company |
|---|---|
| 04713 | FREESCALE SEMICONDUCTOR INC. |
| 82577 | RAYTHEON COMPANY DBA RAYTHEON |
| 34371 | INTERSIL CORPORATION |
| 16236 | DLA LAND AND MARITIME |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| ADAQ | BODY LENGTH | 0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM |
| CSWJ | WORD QUANTITY (NON-CORE) | 64 |
| CZEQ | TIME RATING PER CHACTERISTIC | ERR-060 NOMINAL HAND PULL AND ERR-060 NOMINAL HAND PULL |
| CRHL | BIT QUANTITY (NON-CORE) | 512 |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | PROGRAMMED AND PROGRAMMABLE AND BIPOLAR AND WIRE-OR OUTPUTS AND EXPANDABLE AND W/BUFFERED OUTPUT AND W/ENABLE AND POSITIVE OUTPUTS AND MONOLITHIC AND HERMETICALLY SEALED AND W/DECODED OUTPUT |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| ADAU | BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
| TEST | TEST DATA DOCUMENT | 82577-932085 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 FLAT LEADS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |