National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| DMS 81040B | 16236 | A | 5 | 9 | 9 | TX | ||
| ROM/PROM | 16236 | A | 5 | 1 | 5 | TX | ||
| SM28569 | 27014 | A | 5 | 2 | 5 | TX | ||
| 351-8302-010 | 13499 | A | 3 | 2 | 1 | TX | ||
| IMP-16A/521D | 27014 | A | 5 | 9 | 3 | TX | ||
| 51P06709G001 | 94990 | R | C | 1 | 6 | ZZ | AC |
CAGE Information
| Code | Company |
|---|---|
| 13499 | ROCKWELL COLLINS INC. DBA GOVERNMENT |
| 16236 | DLA LAND AND MARITIME |
| 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| 94990 | MOTOROLA INC. DBA INTEGRATED INFORMA |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| ADAU | BODY HEIGHT | 0.150 INCHES MINIMUM AND 0.190 INCHES MAXIMUM |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -10.0/+70.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 20.0 VOLTS MAXIMUM POWER SOURCE |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| CRHL | BIT QUANTITY (NON-CORE) | 2300 |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST | TEST DATA DOCUMENT | 13499-351-8302 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CZER | MEMORY DEVICE TYPE | ROM |
| ADAT | BODY WIDTH | 0.550 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | W/ENABLE AND HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND NEGATIVE OUTPUTS AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED |
| CSWJ | WORD QUANTITY (NON-CORE) | 100 |
| CQZP | INPUT CIRCUIT PATTERN | 21 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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351-8302-010 ,
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5962010413259 ,
010413259
,
DMS 81040B ,
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SM28569 ,
351-8302-010 ,
IMP-16A/521D ,
51P06709G001 ,